Topics Capacitive Sensor Sheet FPC packing for Water proof Integrated Molding with Silicon material   Introduction Shin-Etsu Capacitive sensor sheet – It offers more creative freedom for product surface and shape. Waterproofing technology for FPC packaging and All in one integrated molding with Silicone material.  

Introducing Hakuto’s Ion Beam Milling (Etching) System which is an optimal etching technology for Magnetic materials, Gold, Platinum, Alloyed metals, and Compound semiconductor materials. Features: Capable to etch any materials, including hard to etch materials(Magnetic and some dielectric materials, Metals). Etching gas is Ar only. (Toxic Gas free). Provides excellent etching uniformity. Flexibility for the…